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Professor. Chin C. Lee
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Chin C. Lee was born in Taiwan. He received
B.E. and M.S. degrees in electronics from National
Chiao-Tung University, Hsinchu, Taiwan, and Ph.D. degree in
electrical engineering from Carnegie-Mellon University,
Pittsburgh, Pennsylvania.
From 1979 to 1980, he was a research associate with
Carnegie-Mellon University. From 1980 to 1983, he was with
the Electrical Engineering Department of the University of
California, Irvine, as a research specialist. In 1984, he
joined the same department as an assistant professor and
became professor of Electrical and Computer Engineering in
July 1994. From 1990/91 to 93/94 and 1999/00 to 2001/02, he
served as the Graduate Advisor of Electrical and Computer
Engineering. He is the Director of Operations of INRF
(Integrated Nanosystems Research Facility), and a member of
the Materials Science and Engineering Graduate Program.
His research interests include integrated optics
devices, semiconductor devices, microwave devices,
electronic packaging, thermal design of electronic devices,
thermal measurement, fluxless bonding technology, flip-chip
packaging, electromagnetic theory, and scanning acoustic
microscopy. His group has invented many fluxless bonding
techniques, developed several software packages for thermal
analysis of electronic devices, invented and realized a new
guided-wave lens structure on GaAs substrate, formulated a
new method for the electrostatic analysis of multilayer
structures with embedded electrodes, produced several
integrated optical devices such as ion electro-migrated
optical waveguides and thermooptic switches, worked on
microwave devices based on single crystal ferromagnetic iron
films grown on GaAs substrates, characterized microwave
devices up to 50GHz, and established a new thermal
measurement technique for visible GaN-based LEDs using
nematic liquid crystal. Publications and Presentations I. Book
Chapters BC1.
C.C. Lee and A.L. Palisoc, "Thermal Analysis of
Semiconductor Devices," a chapter in Topics
in Boundary Element
Research, Vol. 7, pp. 12-33, Editor: C.A. Brebbia,
Springer-Verlag, Berlin, Germany, 1990. BC2.
G.S. Matijasevic, C.Y. Wang and C.C. Lee,
"Thermal Stress Considerations in Die-Attachment,"
a chapter in Thermal
Stress and Strain in Microelectronics Packaging, pp.
194-220, Editor: John H. Lau, Van Nostrand Reinhold, New
York, 1993. BC3.
G. S. Matijasevic, Chin C. Lee and Chen Y. Wang,
"Chip Attachment," a chapter in Handbook
of Chip on Board Technologies for Multichip Modules, pp. 251-274, Editor: John
H. Lau, Van Nostrand Reinhold, New York 1994. II. Journal Publications
Jl.
C.S. Tsai, S.K. Wang, C.C. Lee, "Visualization
of Solid Material Joints Using a Transmission Type Scanning
Acoustic Microscope," Appl. Phys. Lett., 31,
pp. 317-320, Sept. 1977.
J2.
C.S. Tsai, C.C. Lee, J.K. Wang, "Transmission
Scanning Acoustic Microscopy with Applications to
Nondestructive Testing and Evaluation," American
Laboratory, pp. 16-22, April 1979.
J3.
C.C. Lee, K.Y. Liao, C.L. Chang, C.S. Tsai,
"Wideband Guided-Wave Acoustooptic Bragg Deflector
Using Tilted-Finger Chirp Transducer," IEEE J.
Quantum Electronics, QE-15, pp. 1166-1170, Oct.
1979.
J4.
J.K. Wang, C.S. Tsai, C.C. Lee, Spectroscopic Study
of Defects in Thick Specimen Using Transmission Scanning
Acoustic Microscopy," Special Volume on Scanned
Image Microscopy, pp. 137-147, Academic Press, 1980.
J5.
C.C. Lee, C.S. Tsai, and X. Cheng, "Complete
Characterization of Thin and Thick-Film Materials Using
Wideband Reflection Acoustic Microscopy," IEEE
Trans. on Sonics and Ultrasonics, SU-32, pp.
248-258, March 1985.
J6.
Q. Li, C.S. Tsai, S. Sottini, and C.C. Lee,
"Light Propagation and Acoustooptic Interaction in a
LiNbO3 Spherical Waveguide," Appl. Phys.
Letter, 46, pp. 707-709, April 1985.
J7.
C.S. Tsai, D. Young, W. Chen, L. Adkins, C.C. Lee,
and H. Glass, "Noncolinear Co-planar Magnetooptic
Interaction of Guided-Optical Wave and Magnetostatic Surface
Waves In YIG-GGG Waveguides," Appl. Phys. Letter.,
47, pp. 651-54, Oct. 1985.
J8.
C.J. Lii, C.S. Tsai, and C.C. Lee, "Wideband
Guided-Wave Acoustooptic Bragg Cells in GaAs-GaAlAs
Waveguide," IEEE J. Quantum Electronics, QE-22,
pp. 868-872, June 1986.
J9.
C.C. Lee, G. Matijasevic, X. Cheng and C.S. Tsai,
"Imaging and Characterization of Film Coating Using
Scanning Acoustic Microscopy," Thin Solid Films,
154, November 1987, pp. 207-216, also appears in Metallurgical Coatings, 1987, Elsevier, London and New York.
J10.
Chin C. Lee, Arthur L. Palisoc, and John M.W.
Baynham, "Thermal Analysis of Solid State Devices Using
the Boundary Element Method," IEEE Trans. Electron
Devices, 35, pp. 1151-1153, July 1988.
J11.
Arthur L. Palisoc and Chin C. Lee, "Thermal
Properties of The Mutli-Layer Infinite Plate
Structure," J. Appl. Phys., 64(1),
pp.410-415, July 1, 1988.
J12.
Chin C. Lee and Arthur L. Palisoc, "Real-Time
Thermal Design of Integrated Circuit Devices," IEEE
Trans. Components, Hybrids, and Manufacturing Technology,
11, pp. 485-492, December 1988.
J13.
Arthur L. Palisoc and Chin C. Lee, "Exact
Thermal Representation of Multi-Layer Rectangular Structures
by Infinite Plate Structures Using the Method of
Images," J. Appl. Phys., 64(12), pp.
6851-6857, December 1988.
J14.
Goran Matijasevic and Chin C. Lee, "Void-Free
Au-Sn Eutectic Bonding of GaAs Dice and its Characterization
Using Scanning Acoustic Microscopy," J. Electronic
Materials, Special Issue for Packaging Technology,
18, a joint publication of Minerals, Metals, and
Materials Society and the IEEE, pp. 327-337, March 1989.
J15.
Arthur L. Palisoc, Y. Jay Min and Chin C. Lee,
"Thermal Properties of Five Layer Infinite Plate
Structures with Embedded Heat Sources," J. Appl.
Phys., 65(11), pp. 4438-4444, June 1989.
J16.
Chin C. Lee and Goran Matijasevic, "Highly
Reliable Die-Attachment on Polished GaAs Surfaces Using
Gold-Tin Eutectic Alloy," IEEE Trans. Components,
Hybrids, and Manufacturing Tech., 12, pp.
406-409, September 1989.
J17.
Chin C. Lee and Mark M. Minot, "Low-Index
Embedded Waveguide Lenses in GaAs Substrates," IEEE
Photonics Technology Letters, 1, pp. 313-315,
Oct. 1989.
J18.
Chin C. Lee, Arthur L. Palisoc and Y. Jay Min,
"Thermal Analysis of Integrated Circuit Devices and
Packages," IEEE Trans. Components, Hybrids, and
Manufacturing Tech., 12, pp. 701-709, December
1989.
J19.
Chin C. Lee, Y. Jay Min and Arthur L. Palisoc,
"A General Integration Algorithm for the Inverse
Fourier Transform of Four-layer Infinite Plate
Structures," IEEE Trans. Components, Hybrids, and
Manufacturing Tech., 12, pp. 710-716, December
1989.
J20.
B.G. Martin, Z.Y. Cheng and C.C. Lee, "Theory of
Symmetric Multilayer Structures as Layer Replacements for
Chebyshev Acoustic Antireflection Coatings," J.
Acoust. Soc. Am., 87, pp. 193-200, January 1990.
J21.
Mingcher Chao and Chin C. Lee, "Waveguides in
BK7 Optical Glass Fabricated by Transverse Electromigration
of Silver Ions," IEEE Photonics Technology Letters,
2, pp. 409-411, June 1990.
J22.
Chin C. Lee and Y. Jay Min, "A New Technique for
the Electrostatic Analysis of Anisotropic Multilayer
Structures," Electrosoft Journal: Advances in
Electrical Engineering Software, 1, pp. 127-140,
June 1990.
J23.
Chin C. Lee, Mike Lahham and Bill G. Martin,
"Experimental Verification of the Kramers-Kronig
Relationship for Acoustic Waves," IEEE Trans.
Ultrasonics, Ferroelectrics and Frequency Control, 37,
pp. 286-294, July 1990.
J24.
Y. Jay Min, Arthur L. Palisoc and Chin C. Lee,
"Transient Thermal Study of Semiconductor
Devices," IEEE Trans. Components, Hybrids, and
Manufacturing Tech, 13, pp. 980-988, December
1990.
J25.
Goran Matijasevic, Chen Y. Wang and Chin C. Lee,
"Void-Free Bonding of Large Silicon Dice Using Gold-Tin
Alloys," IEEE Trans. Components, Hybrids, and
Manufacturing Tech., 13, pp. 1128-1136, December
1990.
J26.
Mark M. Minot and Chin C. Lee, "A New
Guided-Wave Lens Structure," IEEE J. Lightwave
Technology, 8, pp. 1856-1865, December 1990.
J27.
Chin C. Lee, Chen Y. Wang and Goran Matijasevic,
"A New Bonding Technology Using Gold and Tin Multilayer
Composite Structures," IEEE Trans. Components,
Hybrids, and Manufacturing Tech, 14, pp. 407-412,
June 1991.
J28.
Chen Y. Wang and Chin C. Lee, "A Bonding
Technique for Thin GaAs Dice with Via Holes Using Gold-Tin
Composites," IEEE Trans. Components, Hybrids, and
Manufacturing Tech., 14, pp. 874-878, Dec. 1991.
J29.
Chin C. Lee, Chen Y. Wang, "A Low Temperature
Bonding Process Using Deposited Gold-Tin Composites," Thin
Solid Films, 208, pp. 202-209, Feb. 1992.
J30.
Chin C. Lee, Tzu J. Su and Mingcher Chao,
"Transient Thermal Measurements Using the Index of
Refraction as a Temperature Sensitive Parameter," IEEE
Trans. Components, Hybrids, and Manufacturing Tech., 15,
pp. 625-631, Oct. 1992.
J31.
David H. Chien, Chen Y. Wang and Chin C. Lee,
"Temperature Solution of Five-Layer Structure with a
Circular Embedded Source and Its Applications," IEEE
Trans. Components, Hybrids, and Manufacturing Tech., 15,
pp. 707-714, Oct. 1992.
J32.
G.S. Matijasevic, Chin C. Lee and Chen Y. Wang,
"Gold-Tin Alloy Phase Diagram and Properties Related to
Its Use as a Bond Medium," Thin Solid Films, 223,
pp. 276-287, Feb. 1993.
J33.
Chin C. Lee, Chen Y. Wang and Goran Matijasevic,
"Gold-Indium Alloy Bonding Below the Eutectic
Temperature," IEEE Trans. Components, Hybrids, and
Manufacturing Tech., 16, pp. 311-316, May 1993
J34.
Chin C. Lee, Chen Y. Wang, and Goran Matijasevic,
"Advances in Bonding Technology for Electronic
Packaging," ASME
J. Electronic Packaging, 115, pp. 201-207 June
1993.
J35.
Chin C. Lee and David H. Chien, "An Integration
Algorithm for the Fourier-Bessel Integral Solution of
Five-Layer Structure with a Circular Embedded Source," COMPELL:
The International J. Computation and Mathematics in
Electrical and Electronic Engineering, 12, pp.
205-220, Sept 1993.
J36.
Chen Y. Wang, Yi-Chia Chen and Chin C. Lee,
"Directly Deposited Fluxless Lead-Indium-Gold Composite
Solder," IEEE Trans. Components, Hybrids, and
Manufacturing Tech., 16, pp. 789-793 Dec 1993.
J37.
Tzu J. Su and Chin C. Lee, "An Embedded
Waveguide Lens with Antireflection Layer," IEEE
Photonics Tech. Letters, 6, pp. 89-91, Jan 1994.
J38.
Goran Matijasevic, Yi-Chia Chen and Chin C. Lee,
"Copper-Tin Multilayer Composite Solder for Fluxless
Processing," International J. of Microcircuits and
Electronic Packaging, 17, pp. 108-117, 2nd Qtr.
1994.
J39.
Chin C, Lee and Tzu J. Su, "2 x 2 Single-Mode
Zero-Gap Directional Coupler Thermooptic Waveguide Switch on
Glass," Applied Optics, 33, pp.7016-7022,
Oct. 1994.
J40.
Chin C. Lee, Dave H. Chien, "Electrostatics and
Thermostatics: A Connection between Electrical and
Mechanical Engineering," The International J. of
Engineering Education, 10, pp.434-449,1994.
J41.
Tzu J. Su and Chin C. Lee, "Planar Fabrication
Process of High Coupling Efficiency Interface between
Optical Waveguides of Large Index Difference," Applied
Optics, 34, no.24, pp.5366-5374, Aug. 1995.
J42.
Chin C. Lee and David H. Chien, "The Effect of
Bonding Wire on the Longitudinal Temperature Profiles of
Laser Diodes," IEEE J. Lightwave Tech., 14,
pp.1847-1852, Aug. 1996.
J43.
Chin C. Lee and Yi-Chia Chen, "High Temperature
Tin-Copper Joints Produced at Low Process Temperature for
Stress Reduction," Thin Solid Films, 286,
pp.213-218, 1996.
J44.
Yi-Chia Chen and Chin C. Lee, "Indium-Copper
Multilayer Composites for Fluxless Oxidation-free
Bonding," Thin Solid Films, 283,
pp.243-246, 1996.
J45.
Shih Yuan Lin and Chin C. Lee, "A Full Wave
Analysis of Microstrips by the Boundary Element
Method," IEEE Trans. Microwave Theory and Techniques,
44, pp.1977-1983, Nov. 1996.
J46.
Yi-Chia Chen, William W. So and Chin C. Lee, ¡°A
Fluxless Bonding Technology Using Indium-Silver Multilayer
Composites,¡± IEEE Trans. Components, Packaging, and
Manufacturing Technology, 20, pp. 46-51, March
1997.
J47.
Dave H. Chien, Chin C. Lee, Mike Rachlin, Andy Peake,
and Thomas Kole, "Thermal Analysis of Packaged GaAs
Devices Using Chip Model with Finite Element Method," International
J. of Microcircuits and Electronic Packaging, 20,
no.1, pp.3-11, 1997.
J48.
Thomas Kole, Andy Peake, Michael Rachlin, Dave H.
Chien and Chin C. Lee, ¡°Thermal Modeling Aids the Design
of Packaged Amplifiers,¡± Microwaves & RF, pp.
70-77, Oct. 1997.
J49.
Chin C. Lee, David H. Chien and Chen S. Tsai ¡°An
Optimization Study of Thermal Path from Plastic Packages to
Board,¡± International J. of Microcircuits and
Electronic Packaging, 21, no. 1, pp. 93-99, 1998. J50.
Chen S. Tsai, Jun Su, and Chin C. Lee, ¡°Wideband
Electronically Tunable Microwave Bandstop Filters Using Iron
Film-Gallium Arsenide Waveguide Structure,¡± IEEE Trans.
on Magnetics, pp.3178-3180, Sept. 1999. J51.
Jun Su, Chen S. Tsai, and Chin C. Lee,
¡°Determination of Magnetic Properties of Ultrathin Films
Using Microwave Stripline Technique,¡± Journal of
Applied Physics, 87, pp.5968-5971, May 2000. J52.
William S. So and Chin C. Lee, ¡°A Fluxless Process
of Fabricating In-Au Joints on Copper Substrates,¡± IEEE
Trans. Components and Packaging Technology, 23,
pp. 377-382, June 2000.
J53.
Chin C. Lee and William S. So, ¡°High Temperature
Silver-Indium Joints Manufactured at Low Temperature,¡± Thin
Solid Films, 366, pp.196-201, 2000.
J54.
William S. So, Selah Choe, Ricky Chuang, and Chin C.
Lee, ¡°An Effective Diffusion Barrier Metallization Process
for Copper,¡± Thin Solid Films, 376, pp.164-169, 2000. J55.
W. Wu, C. C. Lee, C. S. Tsai, J. Su, H. J. Yoo, Ricky
Chuang, H. Hopster, ¡°Epitaxially Grown Fe/Ag Ultra Thin
Films on GaAs and Their applications to Widewand Microwave
Notch Filter,¡± Journal of Crystal Growth, 225,
pp.534-539, 2001.
J56. W. Wu, C. C. Lee, C. S. Tsai, J. Su, W. So, H. J. Yoo, and R. Chuang ¡°Fabrication of Ferromagnetic/Semiconductor Waveguide Structures and Application to Microwave Bandstop Filter,¡± J. Vacuum Science and Technology, 19(4), pp.1758-1762, Jul/Aug 2001. J57. Chin
C. Lee, W. Wu and Chen S. Tsai, ¡°Ferromagnetic Resonance
and Microstructrual Studies of Ultrathin Fe/Ag films-GaAs
Waveguide Structures,¡± J. Applied Physics, 91,
pp. 9255- 9260,
June, 2002. J58. Chin C. Lee and Selah Choe, ¡°Fluxless In-Sn Bonding at 140 Degree C,¡± Materials Science and Engineering: A, 333, pp. 45- 50, June, 2002. J59.
Ricky Chuang and Chin C. Lee, ¡°High Temperature
Non-eutectic In-Sn Joints Fabricated by A Fluxless
Process,¡± Thin Solide Films, 414,
pp.175-179, July 2002.
J60. Ricky
Chuang and Chin C. Lee, ¡°Low Loss Deep Glass Waveguides
Produced with Dry-Silver Electromigration,¡± IEEE J.
Lightwave Technology, 20, pp.1590-1597, August 2002.
J61. Ricky Chuang and Chin C. Lee, ¡°Silver-Indium Joints Produced at Low Temperature for High Temperature Devices,¡± IEEE Trans. Components and Packaging Technology, 25, pp. 453-458, Sept. 2002. J62. Chin C. Lee and Ricky Chuang, ¡°Fluxless Non-eutectic Joints Fabricated Using Gold-Tin Multilayer Composite,¡± IEEE Trans. Components and Packaging Technology, 26, pp. 416-422, June 2003. J63. Chin
C. Lee, Ricky W. Chuang, and Dong W. Kim, ¡°A Fluxless Process to Produce Tin-rich Bi-Sn
Solder Joints,¡± Materials Science and Engineering: A,
submitted
for publication. J64. Dongwook
Kim and Chin C. Lee, ¡°Intermetallic Growth and Properties
in Bi-Sn-Au Thin Film Structure Deposited in High Vacuum,¡±
Materials Letters, 57, pp. 3598-3601, 2003.
J65. Jeong Park, Moowhan Shin, and Chin C. Lee, ¡°Thermal Modeling and Measurement of GaN-based HFET Devices,¡± IEEE Electron Device Letters, 24, pp. 424-426, July 2003. J66. Ricky W. Chuang, Dongwook Kim, Jeong Park, and Chin C. Lee, ¡°A Fluxless Process of Producing Tin-rich Gold-Tin Joints in Air,¡± IEEE Trans. Components and Packaging Technology, Dec. 2003, in press.
III. Proceedings of Conference Papers
Cl.
C.S. Tsai, S.K. Wang and C.C. Lee, "Acoustic
Imaging of Jointed Surfaces," Proc. ARPA/AFML Review of Progress
in
Quantitative NDE,
pp. 141-145, June 14-17, 1977, Cornell University.
C2.
S.K. Wang, C.C. Lee and C.S. Tsai,
"Nondestructive Visualization and Characterization of
Material Joints Using a Scanning Acoustic Micro¡©scope,"
1977 IEEE Ultrasonics Symposium Proceedings, pp.
171-175, IEEE Cat. No. 77CH1264-1SU.
C3.
C.S. Tsai, LE T. Nguyen and C.C. Lee, "Optical
Pulse Compression and Very High Speed Light Beam Scanning
Using Guided-Wave Acoustooptic Bragg Diffraction," Topical
Meeting on Integrated and Guided Wave Optics, Technical
Digest, paper TuC3-1, Salt Lake City, Jan. 16-18, 1978.
C4.
C.C. Lee, J.K. Wang, P. Hower and C.S. Tsai,
"Detection and Characterization of Alloy Spikes in
Power Transistors Using Transmission Acoustic
Microscope," Proc. the First International Symposium
on Ultrasonic Materials Characterization, NBS
Special Publication 596, NBS Gaithersburg, Maryland,
June 7-9, 1978.
C5.
C.S. Tsai, J.K. Wang and C.C. Lee, "Imaging and
Characterization of Thick Production-Line Microelectronic
Components Using Transmission Acoustic Microscope," Proc.
ARPA/AFML Review of Progress in Qunatitative NDE, San
Diego, CA, July 17-21, 1978.
C6.
C.C. Lee and C.S. Tsai, "An Acoustooptic
Read-out Scheme for Integrated Optic RF Spectrum
Analyzer," 1978 IEEE Ultrasonics Symposium
Proceedings, pp. 79-81, IEEE Cat. No. 78CH1344-1SU.
C7.
C.S. Tsai, C.C. Lee and I.W. Yao, "Wideband
Integrated Optic Signal Processors," SPIE Vol. 154,
Real-Time Signal Processing, pp. 60-63, San Diego,
CA, August 28-29, 1978.
C8.
J.K. Wang, C.C. Lee and C.S. Tsai,
"Nondestructive Diagnosis of Thick Production-Line
Microelectronic Components Using Transmission Acoustic
Microscope," IEEE International Electron Devices
Meeting, Technical Digest, pp. 449-451,
Washington, D.C., Dec. 4-6, 1978, IEEE Cat. No.
78CH1324-3ED.
C9.
C.S. Tsai, C.C. Lee and J.K. Wang, "Detection
and Characterization of Defects in Thick Multilayer
Microelectronic Components Using Transmission Acoustic
Microscopy," Proc. IEEE International Reliability
Physics Symposium, pp. 178-182, San Francisco, CA, April
24-26, 1979, IEEE Cat. No. 79CH1425-8PHY (winner
of the best paper award). C10.
C.S. Tsai and C.C. Lee, "Acoustooptic Devices
for Integrated Optic Signal Processing,¡± SPIE Vol. 185,
Huntsville Electrooptics Symposium, Huntsville, Alabama,
May 22-25, 1979. C11.
J. K. Wang, C. C. Lee and C. S. Tsai, ¡°Further
Progress on Nondestructive Diagnosis of Hybrid
Microelectronic Components Using Transmission Acoustic
Microscopy,¡± Proc. ARPA/AFML Review of Progress in
Quantitative NDE, La Jolla, CA, July 8-13, 1979. C12.
K.Y. Liao, C.L. Chang and C.C. Lee, "Progress on
Wideband Guided-Wave Acoustooptic Bragg Deflector Using a
Tilted Finger Chirp Transducer," 1979 IEEE
Ultrasonics Symposium Proceedings, pp. 24-27, IEEE Cat.
No. 79CH1482-9SU. C13.
C.C. Lee, J.K. Wang and C.S. Tsai, "Phase
Measurement Using an Amplitude Modulated Carrier for
Transmission Acoustic Microscopy," 1979 IEEE
Ultrasonics Symposium Proceedings, pp. 423-427, IEEE
Cat. No. 79CH1482-9SU. C14.
C.S. Tsai, J.K. Wang and C.C. Lee, "Scanning
Acoustic Microscopy for Study of Interfaces in Solid-State
Devices," The 11th Conference (1979 International)
on Solid State Devices, Digest of Technical Papers
pp. 171-172,
Tokyo, Japan. C15.
C.S. Tsai, C.C. Lee and B. Kim, "A Review of
Recent Progress on Guided-Wave Acoustooptics with
Applications to Wideband Communications and Signal
Processing," Topical Meeting on Integrated and
Guided-Wave Optics, Technical Digest, paper MEl,
Incline Village, Nevada, Jan. 28-30, 1980, IEEE Cat. No.
80CH1489-4QEA. C16.
C.S. Tsai, C.L. Chang and C.C. Lee,
"Acoustooptic Bragg Deflection in Channel Optical
Waveguides," Topical Meeting on Integrated and
Guided-Wave Optics, Technical Digest, paper PD-7,
Incline Village, Nevada, Jan. 28-30, 1980, IEEE Cat. No.
80CH1489-4QEA. C17.
J. K. Wang, C.S. Tsai and C.C. Lee,
"Spectroscopic Study of Materials with Transmission
Acoustic Microscope," Proc. ARPA/AFML Review of
Progress in Quantitative NDE, La Jolla, CA, July 1980. C18.
C.C. Lee, K.Y. Liao, C.L. Chang, and C.S. Tsai,
"Design, Fabrication and Testing of Wideband Planar
Acoustooptic Bragg Cells," SPIE Vol. 239, Annual
International Symposium, San Diego, CA, July 28-August
1, 1980. C19.
C.C. Lee, J.K. Wang and C.S. Tsai, "Acoustic
Microscopy Study of Hybrid Microelectronic Joints," Symposium
on Nondestructive Evaluation-Microstructural
Characterization and Reliability Prediction, Pittsburgh,
PA, Oct. 5-9, 1980. C20.
J.K. Wang, C.S. Tsai and C.C. Lee, "Measurement
of Acoustic Transmission Through Air Cavity Using Acoustic
Microscopy," 1980 IEEE Ultrasonics Symposium
Proceedings, pp. 683-686, IEEE Cat. No.
80CH1602‑2. C21.
K.Y. Liao, C.C. Lee and C.S. Tsai,
"Time-Integrating Correlator Using Guided-Wave
Anisotropic Acoustooptic Bragg Diffraction and Hybrid
Integration,¡± Topical
Meeting on Integrated and Guided-Wave Optics, Technical
Digest, paper WA4, Pacific Grove, CA, January 6-8, 1982,
IEEE Cat. No. 82CH1719-4. C22.
C.S. Tsai, C.C. Lee and K.Y. Liao, ¡°RF Correlation
with Integrated Acoustooptic Modules,¡± WESCON 82, Professional
Program Session Record 26, Anaheim, CA, September 14-16,
1982. C23.
C.C. Lee, K.Y. Liao and C.S. Tsai, "Acoustooptic
Time-Integrating Correlator Using Hybrid Integrated
Optics," IEEE Ultrasonics Symposium Proceedings,
pp. 405-407, San Diego, CA, Oct. 27-29, 1982, IEEE Cat. No.
82CH1823-4. C24.
C.S. Tsai, C.T. Lee and C.C. Lee, "Efficient
Acoustooptic Diffraction in Crossed Channel Waveguides and
Resultant Integrated Optic Module," 1982 IEEE
Ultrasonics Symposium Proceedings, pp. 422-425, IEEE
Cat. No. 82CH1823-4. C25.
C.J. Lii, C.C. Lee, 0. Yamazaki, L.S. Yap, K. Wasa,
J. Merz, and C.S. Tsai, "Efficient Wideband
Acoustooptic Bragg Diffraction in GaAs-GaAlAs Waveguide
Structure," Fourth International Conference on
Integrated Optics and Optical Fiber Communication, Technical
Digest, Paper No. 30B3-2, pp. 252-253, Tokyo, Japan,
June 27-30, 1983, ISBN 4-930813-01-8. C26.
S. Sottini, Q. Li, C.C. Lee, and C. S. Tsai, ¡°A
Hemispherical Waveguide Acoustooptic Correlator,¡± 2nd
European Conference on Integrated Optics, IEEE
Conference Publication No.227, Post-deadline paper,
Firenze, Italy, Oct. 17-18, 1983. C27.
C.S. Tsai, D. Young, L. Akins, C.C. Lee, and H.
Glass, "Planar Guided-Wave Magnetooptic Diffraction by
Magnetostatic Surface Waves in YIG/GGG Waveguide," Topical
Meeting on Integrated and Guided-Wave Optics, Technical
Digest, paper No. TUB3, Kissimmee, Florida, April 24-26,
1984, IEEE Cat. No. 84CH1997-6. C28.
Q. Li, C.S. Tsai, S. Sottini, and C.C. Lee,
"Acoustooptic Interaction in LiNbO3
Spherical Waveguide," Topical Meeting in Integrated
and Guided-Wave Optics, Technical Digest, paper
No. TUB2, April 24-26, 1984, Kissimmee, Florida, IEEE Cat.
No. 84CH1997-6. C29.
C.S. Tsai, C.C. Lee and Phat Le, "A 8.5 GHz
Bandwidth Single-Mode Crossed-Channel Waveguide TIR
Modulator and Switch in LiNbO3,¡±
Topical Meeting on Integrated and Guided-Wave Optics,
Technical Digest, Post-deadline paper, Kissimmee,
Florida, April 24-26, 1984, IEEE Cat. No. 84CH1997-6. C30.
(Invited) C.S. Tsai, Q. Li, C.C. Lee, and S. Sottini,
"Acoustooptic Diffraction in Spherical Waveguides and
Application in RF Signal Processing,¡±
Conference on Lasers and Electro-Optics, Technical
Digest, paper FL1, pp. 238, Anaheim, CA, June 19-22,
1984, IEEEE Cat. No. 84CH1965-3. C31. X. Cheng, C.C. Lee and C.S. Tsai,
"Characterization Methodology for Film Materials Using
Wideband Reflection Acoustic Microscopy,¡± Proc.
ARPA/ALFM Review of Progress in Quantitative NDE, Univ.
California, San Diego, CA., July 8-13, 1984. C32.
(Invited) D. Young, C.S. Tsai, C.C. Lee, and W. Chen,
"Wideband Guided-Wave Magnetooptic Devices Using
Magnetostatic Surface Waves," IEEE International
Workshop on Signal Processings, Italy, Sept. 19-20,
1984. C33.
C.C. Lee, X. Cheng and C.S. Tsai, "Thin- and
Thick-Film Material Characterization Using Wideband
Reflection Acoustic Microscopy," IEEE Ultrasonics
Symposium Proceedings, pp. 618-621, Dallas, Texas, Nov.
14-16, 1984, IEEE Cat. No. 84CH2112-l. C34.
C.J. Lii, C.S. Tsai and C.C. Lee, "A Compact
Miniaturized Acoustooptic Bragg Cell in GaAs-GaA1As
Waveguide,¡± Topical Meeting in Integrated and
Guided-Wave Optics, Technical Digest, paper FCC5,
Atlanta, Georgia, Feb. 26-28, 1986. C35.
Chin C. Lee and Arthur L. Palisoc, "Thermal
Analysis of GaAs Integrated Circuit Devices," IEEE
Gallium Arsenide Integrated Circuit Symposium, Technical
Digest, pp. 115-118, Grenelefe, Florida, Oct. 28-30,
1986, IEEE Cat. No. 86CH2372-l. C36.
C.J. Lii, C.S. Tsai C.C. Lee, and Y.A. Abdelrazek,
"Wideband Acoustooptic Bragg Cells in GaAs
Waveguide," Proc. IEEE Ultrasonics Symposium,
pp. 429-433, Williamsburg, VA., Nov. 17-19, 1986, IEEE Cat
No. 86CH2375-4. C37.
(Invited) C.S. Tsai and C.C. Lee,
"Nondestructive Imaging and Characterization of
Electronic Materials and Devices Using Scanning Acoustic
Microscopy," Proc. SPIE International Symposium on
Pattern Recognition and Acoustical Imaging, SPIE vol.
768, Newport Beach, CA, Feb. 1987. C38.
Arthur L. Palisoc and Chin C. Lee, "Thermal
Design of GaAs Integrated Circuit Devices," Proc.
IEEE Semiconductor Thermal and Temperature Measurement
Symposium, pp. 118-121, San Diego, CA, Feb. 1988, IEEE
Cat. No. 88CH2530-4. C39.
(Invited) Arthur L. Palisoc, Y. Jay Min and Chin C.
Lee, "The Effect of Die-Bond Voids on The Thermal
Performance Degradation of Solid State Devices," l0th
International Conference on Boundary Element Methods,
published in Boundary
Elements X, Vol. 2, pp. 543-554, Brebbia, editor,
Computational Mechanics Publications, Southampton, U.K.,
1988. C40.
Chin C. Lee, Y. Jay Min and Arthur L. Palisoc,
"An Integration Algorithm for The Temperature Solution
of the 4-Layer Infinite Plate Structure," Proc. IEEE
Semiconductor Thermal and Temperature Measurement Symposium,
pp. 48-51, San Diego, CA, Feb. 1989, IEEE Cat. No.
09CH2688-0. C41.
Goran Matijasevic and Chin C. Lee, "A
Reliability Study of Gold-Tin Eutectic Bonding with GaAs
Dice," Proc. IEEE International Reliability Physics
Symposium, pp. 137-140, 1989, Phoenix, AZ, April 11-13,
1989, IEEE Cat. No. 89CH2650-0. C42.
Y. Jay Min, Arthur L. Palisoc and Chin C. Lee,
"Transient Thermal Study of Semiconductor
Devices," Proc. IEEE Semiconductor Thermal and
Temperature Measurement Symposium, pp. 82-87, Phoenix,
AZ, Feb. 6-8, 1990, IEEE Cat. No. 90CH2640-1. C43.
Mark M. Minot and Chin C. Lee, "A New
Guided-Wave Lens Structure in GaAs Substrates," Topical
Meeting on Integrated Photonics Research, Technical
Digest (Optical Society of America), paper no.
WI8, Hilton Head, South Carolina, March 26-28, 1990. C44.
Goran Matijasevic, Chen Y. Wang and Chin C. Lee,
"Extremely Reliable Bonding of Large Silicon Dice Using
Gold-Tin Alloy," Proc. 40th IEEE Electronic
Components and Technology Conference, pp. 786-790, Las
Vegas, Nevada, May 21-23, 1990, IEEE Cat. No. 90CH2893-6. C45.
Y. Jay Min, Arthur L. Palisoc and Chin C. Lee,
"Point Source Thermal Response of Five-Layer
Anisotropic Plate Structures," Proc. IEEE
Intersociety Conference on Thermal Phenomena in Electronic
Systems, pp. 149-153, Las Vegas, Nevada, May 23-25,
1990, IEEE Cat. No. 90CH2798-7. C46.
Y. Jay Min, Arthur L. Palisoc and Chin C. Lee,
"Electrostatic Analysis of Microstrip Structures Using
Boundary Element Methods," Japan/USA Boundary
Elements Symposium, Palo Alto, CA, June 5-7. 1990, in Topics
in Engineering, Vol.
7, Advances in Boundary Elements Methods in Japan and USA,
pp. 435-450, Tanaka, Brebbia and Shaw, editors, Computation
Mechanics Publications, Southampton, UK, 1990. C47.
Chin C. Lee and Y. Jay Min, "Thermal Modeling of
Semiconductor Devices and Packaging Using Analytical
Methods, "National Electronic Packaging and
Production Conference (NEPCON), Anaheim, CA, Feb. 24-28,
1991, published in Proc. the Technical Program of NEPCON,
pp.147-160, Cahners Exposition Group, Des Plaines, IL. C48.
Chin C. Lee, Tzu J. Su and Mingcher Chao,
"Transient Thermal Measurements Using Thermooptic and
Thermoelectric Effects," Proc. IEEE Semiconductor
Thermal and Temperature Management Symposium, pp. 41-46,
Austin, Texas, Feb. 3-5, 1992, IEEE Cat. No. 92CH3095-7. C49.
David H. Chien, Chen Y. Wang and Chin C. Lee,
"Temperature Solution of Five-layer Plate Structure
with An Embedded Circular Source," Proc. IEEE
Intersociety Conference on Thermal Phenomena in Electronic
Systems, pp. 177-182, Austin, Texas, Feb. 5-7, 1992,
IEEE Cat. No. 92CH3096-5. C50.
Chin C. Lee, Chen Y. Wang, Goran Matijasevic, and
Steve Chan, "A New Gold-Indium Eutectic Bonding
Method," Materials Research Society Spring Meeting,
San Francisco, CA., April 27 - May 1, 1992; MRS Symposium Proceedings Vol.
264: Electronic Packaging Materials Science VI,
pp.305-310, Materials Research Society, Pittsburgh, PA,
1992. C51.
Chen Y. Wang and Chin C. Lee, "A Eutectic
Bonding Technology at a Temperature below the Eutectic
Point," Proc. IEEE Electronic Components and
Technology Conference, pp. 502-507, San Diego, CA., May
18-20, 1992, IEEE Cat. No. 92-CH305656-9. C52.
Chin C. Lee, Chen Y. Wang and Goran Matijasevic,
"Advances in Bonding Technology for Electronic
Packaging," The American Society of Mechanical
Engineers Winter Meeting, Proceedings 92-WA/EEP-19,
Anaheim, CA., Nov. 9-13, 1992. C53.
Chin C. Lee and David H. Chien, "Thermal and
Package Design of High Power Laser Diodes," Proc.
IEEE Semiconductor Thermal and Temperature Management
Symposium, pp. 75-80, Austin, Texas, Feb. 2-4, 1993,
IEEE Cat. No. 93CH3226-8. C54.
Chin C. Lee, Chen Y. Wang, Yi-Chia Chen, and Goran
Matijasevic, "A Joining Technique Using Multi-layer
Lead-Indium-Gold Composite Deposited in High Vacuum," Materials
Research Society Spring Meeting, San Francisco, CA,
April 12-16, 1993; MRS
Symposium Proceedings Vol. 314: Joining and Adhesion
of Advanced Inorganic Materials, pp. 235-240, Materials
Research Society, Pittsburgh, PA, 1993. C55.
Yi-Chia Chen, Chen Y. Wang and Chin C. Lee,
"Directly Deposited Lead-Indium-Gold Composite
Solder," Proc. IEEE Electronic Components and
Technology Conference, pp. 1004-1007, Orlando, FL, June
1-3, 1993, IEEE Cat. No. 93-CH3205-2. C56.
Goran Matijasevic, Yi-Chia Chen and Chin C. Lee,
"Copper-Tin Multilayer Composite Solder," Proc.
International Electronic Packaging Conference, pp.
264-273, San Diego, CA, Sept. 12-15, 1993. C57. Chin C. Lee, Yi-Chia Chen, Goran Matijasevic,
and Richard Metzler, "A Fluxless Oxidation-Free Bonding
Technology," Proc. IEEE Electronic Components and
Technology Conference, pp.595-599, Washington DC, May
1-4, 1994, IEEE Cat. No. 94 CH 13241-7. C58. Yi-Chia Chen, Shih J. Lee and Chin C. Lee,
"High Temperature Copper-Tin Joints Manufactured by a 250oC
Fluxless
Bonding Process," Proc. IEEE Multi-Chip Module
Conference, pp.206-211, Santa Cruz, CA, Feb. 1-2, 1995,
IEEE Cat. No. 95CH35726. C59.
David H. Chien and Chin C. Lee, "A Study of Chip
Thermal Crosstalk in Plastic VLSI Packages,¡± Proc IEEE
Semiconductor Thermal Measurement and Management Symp pp.37-38,
San Jose, CA, Feb. 7-9, 1995, IEEE Cat. No. 95CH35733. C60.
David H. Chien and Chin C. Lee, "A Thermal
Design Methodology for VLSI Circuits," ASME
International Intersociety Electronic Packaging Conference,
Maui, Hawaii, March 26-30, 1995., Advances in Electronic Packaging EEP-Vol.10-2, pp.909-914, ASME,
New York, NY, 1995. C61.
Chin C. Lee and Yi-Chia Chen, "Indium-Copper
Multilayer Composite Solder for Fluxless Bonding," Materials
Research Society Spring Meeting, San Francisco, CA,
April 17-21, 1995, MRS
Symposium Proceedings
Volume 390 Electronic
Packaging Materials Science VIII, pp.225-230, Materials
Research Society, Pittsburgh, PA, 1995.
(Winner of MRS graduate student paper award for Yi-Chia
Chen). C62.
(Invited) Chin C. Lee, Yi-Chia Chen and Goran
Matijasevic, "High Temperature Metallic Joints Produced
at Low Process Temperature for Stress Reduction," Third
International Symposium on Semiconductor Wafer Bonding 187th
Meeting of the Electrochemical Society, Inc., Reno,
Nevada, May 21-26, 1995, Proc.
vol. 95-7 Semiconductor Wafer Bonding: Physics and
Applications, pp.546-552, The Electrochemical Society,
Inc, Pennington, NJ. C63. Yi-Chia Chen and Chin C. Lee,
"Multilayer Tin-Silver Composite Solders Deposited in
High Vacuum," Proc. International Electronics
Packaging conference, pp.258-264, San Diego, CA, Sept.
24-27, 1995. C64.
Dave H. Chien, Chin C. Lee, Mike Rachlin, Andy Peake,
and Thomas Kole, "Thermal Analysis and Measurement of
Plastic Packaged GaAs Devices," IEEE Semiconductor
Thermal Measurement and Management Symp., pp.89-96,
Austin, Texas, March 5-7, 1996. C65.
Michael Rachlin, Andy Peake, An-Yu Kuo, Wen-Tang
Chen, Chin C. Lee, and Dave H. Chien,
"Thermo-Mechanical Analysis and Design of a GaAs RF
Plastic Package," IEEE Intersociety Conference on
Thermal Phenomena in Electronic Systems, pp.233-238,
Florida, May 1996. C66.
Chin C. Lee, Jae W. Lee, David H. Chien, and Robert
Shih, ¡°Transient Thermal Study of Laser Diodes,¡± IEEE
Semiconductor Thermal Measurement and Management Symp.,
Austin, Texas, pp.218-223, January 28-30, 1997. C67.
Chin C. Lee and Dave H. Chien, ¡°Stress Analysis of
Chip-Bonded Devices,¡± National Electronic Packaging and
Production Conference (NEPCON), pp. 1395-1408, Anaheim,
CA, Feb. 25-27, 1997. C68.
Chin C. Lee and David H. Chien, ¡°A Thermally
Enhanced Plastic Package with Indented Leadframe,¡± IEEE
Electronic Components and Technology Conference, pp.
338-342, San Jose, CA, May 18 - 21, 1997. C69.
Thomas Kole, Andy Peake, Michael Rachlin, Dave H.
Chien and Chin C. Lee, ¡°Thermal Design of Plastic Packaged
GaAs RFIC Power Amplifiers,¡± Proc. Wireless Symposium,
pp. 473-482, 1997. C70.
Linh Ha, Goran Matijasevic, Pradeep Grandhi,
Catherine Gallagher, and Chin C. Lee, ¡°Thermal Study of
Additive Multilayer Circuitry on Polymer and Metal
Substrates,¡± IEEE Semiconductor Thermal Measurement and
Management Symp., pp.104-110, San Diego, CA, March
10-12, 1998. C71.
William W. So and Chin C. Lee, ¡°Alloy Joints for
High Temperature Electronic Packaging¡± Materials
Research Society Spring Meeting, San Francisco, CA,
April 13-17, 1998, MRS Symposium Proceedings Volume
515 Electronic Packaging Materials Science X, pp.91-97,
Materials Research Society, Pittsburgh, PA, 1998. C72.
William W. So and Chin C. Lee, ¡°High Temperature
Joints Manufactured at Low Temperature,¡± Proc. EEE
Electronic Components and Technology Conference, pp.
284-291, Seattle, Washington, May 25 - 28, 1998. C73.
Chin C. Lee and Juan Velasquez, ¡°Transient Thermal
Measurement of Laser Diodes,¡± Proc. IEEE Electronic
Components and Technology Conference, pp. 1427-1430,
Seattle, Washington, May 25 - 28, 1998. C74.
C.S. Tsai, C.C. Lee, J. Su, W. So, W. Zuo, G.
Griergiel, H. Kopster, and D.L. Mills, ¡°Microwave and
Magnetostatic Wave Devices Using Thin-Film
Magnetic-Semiconducting Material Structures,¡± 3rd
International Symp. on Metallic Multilayers (MML¡¯98),
Vancouver, British Columbia, Canada, June 14-19, 1998. C75.
(Invited) Chin C. Lee and William W. So, ¡°Fluxless
Bonding and Soldering Technology,¡± Proc. International
Electronic Devices and Materials Symposia, pp.318-326,
Tainan, Taiwan, Dec. 20-23, 1998. C76.
C.S. Tsai, C.C. Lee, J. Su, W. So, W. Zuo, W. Wu, G.
Griergiel, H. Kopster, and D.L. Mills, ¡°Wideband Microwave
Bandpass Filter Using Ultrathin Iron Film-Gallium Arsenide
Layer Structure,¡± Material Research Meeting, paper
no. J9.1, San Francisco, California, April 5-9, 1999. C77. Chen S. Tsai, Jun Su, and Chin C. Lee,
¡°Wideband Electronically Tunable Microwave Bandstop
Filters Using Iron Film-Gallium Arsenide Waveguide
Structure,¡± International Conference on Magnetics
(INTERMAG), paper no. BE-08, Kyongju, Korea, May 18-21,
1999. C78.
William W. So and Chin C. Lee, ¡°A Fluxless Process
of Producing In-Au Joints on Copper Substrates,¡± Proc.
IEEE Electronic Components and Technology Conference,
pp. 278-282, San Diego, California, June 1-4, 1999. C79. Jun Su, Chen S. Tsai, and Chin C. Lee,
¡°Determination of Magnetic Properties of Ultrathin Films
Using Microwave Stripline Technique,¡± Conference on
Magnetism and Magnetic Materials, San Jose, California,
Nov. 15-18, 1999. C80.
Selah Choe, William W. So, and Chin C. Lee, ¡° Low
Temperature Fluxless Bonding Technique Using In/Sn
Composite,¡± Proc. IEEE Electronic Components and
Technology Conference, pp. 114-118, Las Vegas, Nevada,
May 21-24, 2000. (Among 7 finalists for
Motorola-IEEE/CPMT Society Fellowship in Electronic
Packaging Research for Selah Choe) C81.
William W. So, Selah Choe, Ricky Chuang, and Chin C.
Lee, ¡°A Barrier Metallization Technique on Copper
Substrates for Soldering Applications¡±, Proc. IEEE
Electronic Components and Technology Conference, pp.
855-860, Las Vegas, Nevada, May 21-24, 2000. C82.
Ricky Chuang and Chin C. Lee, ¡°A Dry Silver
Electromigration Process to Fabricate Optical Waveguides on
Glass Susbstrats,¡± Proc. IEEE Electronic Components and
Technology Conference, pp.1511-1514 , Las Vegas, Nevada,
May 21-24, 2000. C83. C. S. Tsai, Wei Wu, C. C. Lee, J. Su, W. So,
H. J. Yoo, and R. Chuang, ¡°Ferromagnetic Resonance Study
of Untrathin Iron Films and Application to Microwave
Bandstop Devices,¡± 5th International Conference
on Nanostructured Materials (NANO2000), Sendai,
Japan, August 20-25, 2000. C84. Selah Choe, Ricky Chuang, and Chin C.
Lee, ¡°Fluxless Sn/Bi/Au Bonding Process Using Multilayer
Design,¡± Proc. IEEE Electronic Components and
Technology Conference, pp. 486-488, Lake Buena Vista,
Florida, May 29-June 1, 2001.
(Among 7 finalists for Motorola-IEEE/CPMT Society
Fellowship in Electronic Packaging Research for Selah Choe) C85. Ricky Chuang and Chin C. Lee,
¡°Low-loss Deep Glass Waveguides Produced with Dry Silver
Electromigration Process,¡± Proc. IEEE Electronic
Components and Technology Conference, pp. 655-659, Lake
Buena Vista, Florida, May 29-June 1, 2001.
(Winner of the Motorola-IEEE/CPMT Society
Fellowship in Electronic Packaging Research for Ricky
Chuang) C86. Ricky Chuang, Selah Choe, and Chin C.
Lee, ¡°A Fluxless Sn-In Bonding Process Achieving High
Re-melting Temperature,¡± Proc. IEEE Electronic
Components and Technology Conference, pp. 671-674, Lake
Buena Vista, Florida, May 29-June 1, 2001. C87. Ricky Chuang and Chin C. Lee, ¡°Deep
Low-loss Multimode Channel Waveguides Fabricated on Glass
Substrates Using Dry Silver Film Electromigration
Technique,¡± Technical Digest OSA/IEEE Integrated
Photonics Research Topical Meetings, paper no. IMC4,
Monterey, California, June 11-13, 2001. C88. J. Park, C. C. Lee, J. W. Kim, J. S.
Lee, W. S. Lee, J. H. Shin, and M. W. Shin, ¡°Thermal
analysis of GaN-based HFET Devices Using the Unit Thermal
Profile Approach,¡± Proc. International Conference on
Silicon Carbide and Related Materials (ICSCRM), Tsubuka,
Japan, Oct. 28. – Nov. 2, 2001. C89. Chin C. Lee and Ricky Chuang, ¡°A Dry
Silver Electromigration Process for Fabricating Low-loss
Channel Glass Waveguides,¡± Proc. Electronic Devices and
Materials Symposia, pp. 10-17, Kaohsiung, Taiwan, Dec.
12-13, 2001. C90. Ricky W. Chuang, Dongwook Kim, Jeong
Park, and Chin C. Lee, ¡°A Fluxless Bonding Process of
Tin-rich Compositions Achieved in Ambient Air,¡±
Proc. IEEE Electronic Components and Technology
Conference, pp. 134-137, San Diego, California, May
28-31, 2002. C91. Jeong Park, Selah Choe Park, Moo Shin,
and Chin C. Lee, ¡°Thermal Study of GaN-based HFET
Devices,¡± Proc. IEEE Electronic Components and
Technology Conference, pp. 617-621, San Diego,
California, May 28-31, 2002. C92. Jeong Park, Scott Diestel, Scott
Richman, Frank Chen, Jon Mooney, David Escobar, Darryl Sato,
and Chin C. Lee, ¡°Hot Spot Measurement on CMOS-based image
Sensor Using Liquid Crystal Thermograph,¡± Proc. IEEE
Electronic Components and Technology Conference, pp.
1627-1630, San Diego, California, May 28-31, 2002. C93. Jeong Park, Dimitri Kakovitch, Moo W.
Shin, and Chin C. Lee, ¡°Thermal Modeling and Measurement
of AlGnN/GaN HFETs Built on Sapphire and SiC Substrates,¡± Proc.
IEEE Electronic Components and Technology Conference,
pp. 438-442, New Orleans, Louisiana, May 27-30, 2003. (Among
seven finalists of the Motorola-IEEE/CPMT Society Fellowship
in Electronic Packaging Research for Jeong Park). C94.
Dongwook Kim and Chin C. Lee, ¡°New Fluxless Bonding
Process in Air using Sn-Bi with Au Cap,¡± Proc. IEEE
Electronic Components and Technology Conference, pp.
668-672, New Orleans, Louisiana, May 27-30, 2003. C95.
Dongwook Kim, Chin C. Lee, and Witold M. Sokolowski,
¡°Fluxless Flip-Chip technique Using Sn-Au Solder Bumps on
This Si Chips,¡± Proc. IEEE Electronic Components and
Technology Conference, pp. 840-843, New Orleans,
Louisiana, May 27-30, 2003. C96. Jeong Park and Chin C. Lee,
¡°Microwave Measurements on Dielectric Constants and
Dissipation Factors of Dielectric Materials,¡± Proc.
IEEE Electronic Components and Technology Conference,
pp. 1800-1803, New Orleans, Louisiana, May 27-30, 2003.
IV. Conference and Invited Presentations
P1.
C. C. Lee, J. K. Wang and C.S. Tsai,
"Nondestructive Characterization of Defects in Thick
Production-Line Microelectronic Components Using
Transmission Acoustic Microscopy," The
Electrochemical Society Meeting, Pittsburgh, PA, Oct.
15-20, 1978.
P2.
C.C. Lee, K.Y. Liao, C.L. Chang, and C.S. Tsai,
"Design, Fabrication and Testing of Wideband Planar
Acoustooptic Bragg Cells," 1980 SPIE Annual
International Symp., San Diego, CA,
July 28 - Aug. 1, 1980.
P3.
(Invited) Chin C. Lee, "Thermal Analysis and
Die-Bonding Technology for GaAs De¡©vices," First
Rockwell International Advanced Electronics Packaging
Symposium, Anaheim, CA,
June 5, 1986.
P4.
J.M.W. Baynham, C.C. Lee and A.L. Palisoc,
"Application of the Boundary Element Method To Thermal
Design of Solid State Integrated Circuits," 8th ASME
International Heat Transfer Conference, San Francisco,
CA, Aug. 18-22, 1986.
P5.
(Invited) Chin C. Lee, "Thermal Analysis of GaAs
Devices," Thermal Measurements in Semiconductor
Electronics Workshop, Organized by Hewlett Packard,
Hilton Hotel, Sunnyvale, CA,
Sept. 3-4, 1986.
P6.
(Invited) Chin C. Lee, "Nondestructive
Visualization of Die-Bonded Devices Using Scanning Acoustic
Microscopy and The Thermal Analysis of Solid State
Devices," TRW, Applied Technology Division, Redondo
Beach, CA., July 16, 1987.
P7.
(Invited) Chin C. Lee and Arthur L. Palisoc,
"Thermal Analysis of Solid State and Integrated Circuit
Devices," Telecommunication Laboratories, Taiwan, Aug.
12, 1987.
P8.
(Invited) Chin C. Lee, "Coherent Fiber Optics
Communications," Telecommunication Laboratories,
Taiwan, Aug. 24, 1988; and Telecommunication Training
Institute, Taiwan, Aug. 25, 1988.
P9.
(Invited) Chin C. Lee, "Void-Free GaAs
Die-Attachment Using Au-Sn Alloy," and "The Method
of Images on The Thermal Analysis of Multi-Layer
Structures," TRW, Applied Technology Division, Redondo
Beach, CA, Oct. 14, 1988.
P10.
(Invited) Chin C. Lee, "Die-Bonding Technology
Using Au-Sn Alloy," Telecommunication Labs., Taiwan,
Aug. 31, 1989.
P11.
(Invited) Chin C. Lee, "Semiconductor Optical
Amplifiers," Telecommunications Labs., Taiwan, Sept. 5,
1989.
P12.
(Invited) Chin C. Lee, "Die-Bonding Technology
and Thermal Study for GaAs Devices," Rockwell
International, Newbury Park, CA, Oct. 17, 1989.
P13.
Chin C. Lee, "Bonding Technology for
Semiconductor Device Chips," Electrical and Computer
Engineering Colloquium, ECE 294, University of
California, Irvine, CA, Oct. 18, 1989.
P14.
(Invited) Chin C. Lee, "Recent Progress in
Bonding Techniques and Transient Thermal Analysis,"
Rockwell International, Newbury Park, CA, March 2, 1990.
P15.
(Invited) Chin C. Lee, "A New Guided-Wave Lens
Structure in GaAs Substrate," TRW, Electronics and
Technology Div., Redondo Beach, CA, April 6, 1990.
P16.
(Invited) Chin C. Lee and Mark M. Minot, "A New
Guided-Wave Lens Structure in GaAs Substrate," Annual
Meeting of the Photonics Society of Chinese-Americans,
Lincoln Plaza Hotel, Monterey Park, CA, January 26, 1991.
P17.
Chin C. Lee, "A New Bonding Technique of Fibers
on Integrated Optic Devices," Telecommunication
Laboratories, Taiwan, July 3, 1991.
P18.
(Invited) Chin C. Lee, "A New Bonding Technology
Using Multilayer Gold-Tin Composites," TRW, Electronics
and Technology Div., Redondo Beach, CA, July 24, 1991.
P19.
Chin C. Lee, "A New Bonding Technology Using
Gold-Tin Multilayer Composites for Electronic
Packaging," Research Review in Optical and Solid
State Devices Thrust Area, Department of Electrical
and Computer Engineering, University of California,
Irvine, CA., May 8, 1992.
P20.
(Invited) Chin C. Lee, "Advances in Gold-Tin
Bonding Technology," IEEE Components Hybrids and
Manufacturing Technology Society Technical Meeting,
San Diego Chapter, Embassy Suites Hotel, La Jolla, CA, Nov.
17, 1992.
P21.
(Invited) Chin C. Lee, "Thermal Analysis and
Bonding Technology for Integrated Electronic Devices,"
Nippondenso Technical Center, Carlsbad, CA, Dec. 8, 1992.
P22.
(Invited) Chin C. Lee, "Advances in Fluxless
Bonding Technology," Torranaga Technologies, Inc.,
Carlsbad, CA, Oct. 8, 1993.
P23.
(Invited) Chin C. Lee, "Bonding Techniques for
Low Temperature Application in Space" Jet Propulsion
Laboratory, Low Temperature Physics Group, Pasadena, CA,
Feb. 23, 1994. P24. (Invited)
Chin C. Lee, "Thermal and Structural Modelings of
Semiconductor Devices," and "Fluxless
Oxidation-Free Bonding Technology," ITT Gallium
Arsenide Technology Center and Microelectronics Center,
Roanoke, VA, March 11, 1994. P25. (Invited)
Chin C. Lee, ¡°Thermal Stress Analysis of Die-bonded
Devices and Fluxless Bonding Technology,¡± Coherent Laser
Group, Santa Clara, CA, Dec. 17, 1997. P26. (Invited)
Chin C. Lee, ¡°Fluxless Bonding Technology Using Multilayer
Composite Metallization,¡± International Microelectronic
and Packaging Society SoCal Symp., WestCoast Hotel,
Anaheim, CA, May 12, 1998. P27.
(Invited) Chin C. Lee, ¡°Fluxless Bonding Technology
for Photonics,¡± Technical Meeting, Photonics
Society of Chinese Americans: So. California Chap., El
Monte, CA., Feb. 27, 1999. P28. (Invited)
Chin C. Lee, ¡°Lead-tin Solder Properties and
Soldering-related Issues,¡± E-TEK Dynamics, San Jose, Sept.
24, 1999. P29. (Invited)
Chin C. Lee, ¡°Single Crystal Iron Film Growth on GaAs
using MBE and Related Ferromagnetic Microwave Devices,¡±
Electrical Engineering Department, National Cheng Kung
University, Tainan, Taiwan, Dec. 16, 1999, and Electronics
Engineering Department, National Chiao Tung University,
Hsinchu, Taiwan, Dec. 21, 1999, a tour invited and sponsored
by the National Science Council. P30. (Invited)
Chin C. Lee, ¡°Fluxless Bonding and Soldering Technology
for Microelectronics,¡± Materials Science and Engineering
Department, National Cheng Kung University, Dec. 17, 1999,
Institute of Electro-Optical Enngineering, National Sun
Yat-Sen University, Kaohsiung, Taiwan, Dec. 20, 1999, a tour
sponsored by the National Science Council. P31. (Invited) Chin C. Lee, ¡°Fluxless Bonding and Soldering Technology,¡± Electrical and Computer Engineering Dept., University of California, San Diego, April 21, 2000. P32. Wei
Wu, C. S. Tsai, C. C. Lee, H. J. Yoo, H. Hopster, and D. L.
Mills, ¡°Ferromagnetic Fe/Ag-GaAs Waveguide Structures for
Wideband Microwave Integrated Notch Filter Devices,¡± Device
Research Conference, University of Denvor, Denvor,
Colorado, June 19-21, 2000. P33 (Invited)
C. S. Tsai, C. C. Lee and W. Wu, ¡°Ultrathin Iron
(Fe)-Gallium Arsenide (GaAs) Layer Structures for Wideband
Microwave Devices,¡± 8th Asia Pacific Physics
Conference, Academia Sinila, Taipei, Taiwan, August 7 -
10, 2000. P34. W. Wu, C. S. Tsai, C. C. Lee, J. Su, H. Hopster, and H. J. Yoo, ¡°Epitaxially Grown Fe/Ag Thin Films and Their Applications in Microwave Notch Filter Devices,¡± American Conference on Crystal Growth and Epitaxy (ACCGE-12), Vail, Colorado, Aug. 14-16, 2000. P35. W. Wu, C. S. Tsai, C. C. Lee, H. J. Yoo, R. Chuang, H. Hospter, ¡°Ferromagnetic Resonance and Magnetic Anisotropy in Epitaxial Fe/Ag Thin Films on GaAs (100),¡± American Vacuum Society 47th International Symposium: Vacuum Thin Films and Surfaces/Interfaces and Processing, NANO-6, paper no. TF-TuP31, Boston, Massachusetts, October 2-6, 2000. P36. W. Wu, C. S. Tsai, C. C. Lee, H. J. Yoo and J. Su ¡°Ferromagnetic Fe/Ag-GaAs Waveguide Structures for Wideband Microwave Notch Filter Devices,¡± American Vacuum Society 47th International Symposium: Vacuum Thin Films and Surfaces/Interfaces and Processing, NANO-6, paper no. MI+EL-WeA5, Boston, Massachusetts, October 2-6, 2000. P37.
(Invited) Chin C. Lee, ¡°Non-eutectic Tin-Rich
Gold-Tin Joints Produced by Fluxless Process,¡± Institute
of Elecctro-Optical Engineering, National Sun Yat-Sen
University, Kaohsiung, Taiwan, Dec. 17, 2001, sponsored by
the Taiwan National Science Council. P38. (Invited)
Chin C. Lee, ¡°Fluxless Bonding Technology for MEMS and
Photonics,¡± Dinner meeting on the New Opto-Electronics
Industry, co-sponsored by So. California Monte-Jade Science
and Technology Association and Photonics Society of Chinese
Americans (PSC), Long Beach, Ca, PSE New Fellow Speech, May
22, 2002. P39 .
(Invited) Chin C. Lee, ¡°Fluxless Bonding Technology
of Coefficient of Thermal Expansion Mismatched Materials and
High Temperature Devices,¡± Intel, Chandler, AZ, June 14,
2002. P40. (Invited)
Chin C. Lee, ¡°Effects of Dielectric Constant and
Dissipation Factor on the Performance of High Frequency
Electron Devices,¡± Ablestik Laboratories, a National
Starch & Chemical Company, Rancho Dominguez, CA, Aug. 9,
2002. P41. (Invited)
Chin C. Lee, ¡°Fluxless Soldering Technology for MEMS and
Photonics,¡± UC SMART Workshop on Lead-free
Solders for Electronic, Optical, and MEMS Packaging
Manufacturing, UCLA, Sept. 5 & 6, 2002. P42. Dong Kim, Ricky Chuang, and Chin C. Lee, ¡°A
Fluxless Au-Sn process achieved in air ambient,¡±
UC SMART Workshop on Lead-free Solders for
Electronic, Optical, and MEMS Packaging Manufacturing,
UCLA, Sept. 5 & 6, 2002. P43
(Invited) Chin C. Lee, ¡°Fundamental of
Bonding:Fluxless Bonding Technology for Microelectronics,¡±
ECE294, ECE Colloquium, UC Irvine, Oct. 9, 2002. P44 ¡°Thermal Analysis of GaN-based Devices,¡± Interenational Confrenceon Nitride Semiconductors (ICNS), May 25-30, 2003, Japan. V. Other Creative Works
W1.
Y. Jay Min, Chen Y. Wang, Dave H. Chien and Chin C.
Lee, "PAMIE - A Program for the Potential Analysis of
Multi-Layer Infinite Plate Structures with Embedded Sources,
Version 2.1," Software and Users Manual, Sept 1991;
"PAMIE, Version 2.2" Feb 1992.
W2.
Chin C. Lee and David H. Chien, "PAMICE - A
Program for the Potential Analysis of Multi-Layer Infinite
Plate Structures with Circular Embedded Sources, Version
1.0," Software and Users Manual, 1994. W3. David H. Chien and Chin C. Lee, "TRANS -
A Program for the Transient Thermal Analysis and Study of
Semiconductor Devices, Version 1.0," Software and Users
Manual, March 1995. W4. David H. Chien and Chin C. Lee,
"UNITHERM - A Program for Real Time Thermal Design of
Semiconductor Devices Using Unit Thermal Profile Approach,
Version 1.0,"
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