Dongwook Kim (M��03) received the B.S. and M.S. degree in metallurgical engineering from Hanyang University, Seoul, Korea, in 1988, and 1995, respectively. He worked at Samsung Electron Mechanics from 1995 to 1996 where he involved with materials and process development of high frequency surface acoustic wave (SAW) filter as a process engineer. In April 2001, he joined the Materials Science and Engineering program of University of California, Irvine, where he is currently pursuing the Ph.D. degree. His research interests include fluxless lead free solder bonding technologies for electronic devices and flip chip interconnection technology.

Email:dongwook@uci.edu