Electronic Packaging Research
Fluxless bonding techniques, flip-chip micro-solder bonding technique, and packaging technology for high temperature devices.
In-house thermal analysis codes, thermal measurement and hot spot detection using nematic liquid crystal,  study of performance dependence on junction temperature.
Measurement of dielectric constants and dissipation factors for a variety of electronic and packaging materials using RF impedance/material analyzer
 

Development and analysis of Microwave Device/ high frequency Interconnects Research

New 3 dimensional transmission line With Low attenuation and high isolation
RF characterization and development of High performance flip-chip interconnections