Jongsung Kim received the B.S. Degree in Metallurgical Engineering from the Korea University, Seoul, Korea, in 2000 and the M.S. Degree in Materials Science and Engineering from the University of California, Los Angeles, in 2002. While working with Professor King-Ning Tu in the Electronic Thin Film Laboratory at UCLA, his research topic was ��Flow kinetics of molten Pb-free solders along v-groove etched on (001) Si surface�� and was supported by National Semiconductor Corporation. Since June 2003, he has been working as a PhD student in the Electrical and Computer Engineering Department with the concentration of Materials Science at the University of California, Irvine. He is currently working as a research assistant in the Integrated Photonics and Electronic Packaging Laboratory under guidance of Professor Chin C. Lee. His current research interest is focused on the Fluxless Flip chip bonding using lead free solder bumps, Fluxless solder bonding technologies for photonic devices in air ambient, Design, fabrication and test of flip chip packaging for Power amplifier, Thermal mechanical and electrical evaluations of flip chip joint.